Our range of accessories are designed to be incorporated into your heat sink. All ABL's BGA heatsinks are supplied with thermal tape. See details below. They can also be designed for customised heat sinks - please contact us for design support.
With excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components.
It consists of an aluminium foil backing coated, on both sides, with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heatsink and to metal enclosure surfaces.
Typical Properties
|
Colour |
- |
White |
|
Backing Type / Thickness |
mm |
Aluminium Foil / 0.10 |
|
Adhesive Type / Thickness |
mm |
Acrylic 0.075 (on clear liner side), 0.095 (on blue liner side) |
|
Total Thickness |
mm |
0.27 |
|
Adhesion |
Kg/25mm |
1.5 |
|
Thermal Conductivity |
W/m-K |
0.95 |
|
Thermal Resistance |
°C-in²/W |
0.2 |
|
Holding Power @ 23°C |
Hour |
>72 |
|
Holding Power @ 130°C |
Hour |
>2 |
Storage and Shelf Life
Six Months when stored at 23+/-3°C, 60+/-10% relative humidity, out of direct sunlight, in original packaging.
NOTICE
While we believe them to be reliable, the statements and information herein are only for general guidance and are not warrants or guarantees for accuracy and completeness. The user must by test or otherwise determine suitability for purpose. THERE IS NO WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, our standard terms and conditions of sale apply exclusively to all orders, and ALL LIABILITY FOR DAMAGES OF ANY KIND, INCLUDING CONSEQUENTIAL, EXCEEDING PURCHASE PRICE IS EXCLUDED. No one is authorised by us to make oral warranties. We reserve the right to make changes without notice in our products and publications.
